NTC electronic components and advanced technologies. Autex SPb
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24-PIN TSSOP ~ PW, PWP PACKAGE SUFFIX
DIMENSIONS
  MILLIMETERS INCHES
MIN MAX MIN MAX
A 4.30 4.48 .169 .176
B 7.70 7.90 .303 .311
C - 1.10 - .043
C1 .90 REF. .0354 REF.
C2 .05 .15 .002 .006
D 6.25 6.50 .246 .256
E .65 BSC .0256 BSC
F .18 .30 .007 .012
F1 .09 .18 .003 .007
L .50 .70 .020 .028
{short description of image} 0° 8° 0° 8°
ma2138
NOTES:
1. CONTROLLING DIMENSION: MILLIMETERS. INCHES SHOWN FOR REFERENCE ONLY.
{short description of image} ‘A’ AND ‘B’ DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15mm PER SIDE.
{short description of image} THE BASIC LEAD SPACING IS 0.65mm BETWEEN CENTERLINES. EACH LEAD CENTERLINE SHALL BE LOCATED WITHIN ±0.10mm OF ITS EXACT TRUE POSITION.
4. LEADS SHALL BE COPLANAR WITHIN 0.08mm AT THE SEATING PLANE.
{short description of image} DIMENSION ‘F’ DOES NOT INCLUDE DAMBAR PROTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED ‘F’ MAXIMUM BY MORE THAN 0.08mm. DAMBAR CAN NOT BE LOCATED ON THE LOWER RADIUS OR THE LEAD FOOT.
{short description of image} THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10mm AND 0.25mm FROM THE LEAD TIP.
{short description of image} ‘C2’ IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT OF THE PACKAGE BODY (BASE PLANE).